IHEEP 2018

Transoft Solutions is a Platinum Sponsor of the 60th Annual International Highway Engineering Exchange Program (IHEEP) Conference in Lincoln, Nebraska. This important event includes professionals who are implementing innovations at the International, Federal, State and local levels of government, engineering consulting firms and different technology partners.

The environment of the event facilitates peer exchange of information amongst all parties, and allows participants to synergize to advance infrastructure by providing an event conducive to this sharing of information. This is a unique opportunity that brings together people who can and do influence change in the transportation field.

 

WHAT WE WILL BE PRESENTING
Along with our exhibit booth, we’ll be presenting at two sessions:

  • WORKFLOW FOR A 3D AUDIT OF SURFACE GRADING AND CONSTRUCTION MODELS
    It is standard practice to evaluate designs such as roundabouts in 2D but there is no mandated check of how the design performs in 3D. This presentation introduces a workflow for checking design surface/vehicle interaction early on during the 3D design process.

 

  • DEVELOPING DOT ARTERIAL HIGHWAYS ASSETS; SIGNS AND LINES, INTO USABLE 3D MODELS
    This demonstration workflow shows how DOTs can use BIM collaboration software to save money by minimizing design errors through the use of 3D to clash detect signs along a freeway.

 

Event Info
Date
Sep 23, 2018 – Sep 27, 2018
Location

The Lincoln Marriott Cornhusker Hotel
333 South 13th Street
Lincoln, NE, USA
Transoft Booth#: 1

Lincoln, NE, USA